WEBINAR: EuroPAT-MASIP project news
Free Webinar on 28.6.2018 at 14-17 CET: EuroPAT-MASIP ECSEL JU project news - Recent advantages in electronics packaging and related technologies
The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments. The 12 min pitches introduce the topics and highlight the key findings.
EuroPAT-MASIP ECSEL-JU project strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. The three-year project with 30 M€ total budgets is coordinated by Amkor technologies' Steffen Kröhnert. The 28 partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user. www.europat-masip.eu
Focusing on fan-out wafer level packaging (FO-WLP), the project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor, next-generation WL camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology.
The Webinar highlights the key results achieved during the first 18 months of the project
The registrees will be contacted by email for joining instructions.